Aluminium Scandium (AlSc) Sputtering Target
Aluminium Scandium (AlSc) Sputtering Target

Aluminium Scandium (AlSc) Sputtering Target

Scandium has a good dispersion strengthening effect on aluminum. It is a stable non-recrystallization structure during hot working or annealing state. Some alloys are cold rolled plates, which have large deformation and retain this structure even after annealing.
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Products Description

 

Aluminum scandium alloy is a high performance aluminum alloy, the addition of scandium in aluminum alloy, can increase grain refinement. Compared with traditional aluminum alloys, aluminum alloys with scandium have a more refined grain structure, which improves the strength, toughness and fatigue resistance of the material. Our aluminum-scandium (Al-Sc) sputtering target is a high-purity alloy target material, widely used in semiconductor, microelectronics, aerospace and high-end optical coating fields.

 

Because of scandium can significantly inhibit the growth of grains and form fine grains, thereby improving the yield strength and durability of the material. This makes aluminum-scandium targets particularly suitable for manufacturing aerospace components that require high strength and lightness, especially in situations where they need to withstand complex stresses and high temperature environments.

 

Specification of Aluminium Scandium (AlSc) Sputtering Target

 

Item

AlSc Alloy Target

Material

Aluminium Scandium Alloy

Purity

>4N >99.99%

Size

Customized

Color

Silver

Shape

Customized

Surface

Polished Surface;Ra≤0.8μm

Density

≥4.508g/cm³(98%)

Application

Used for Semiconductor,PVD Film Coating,Optical Thin Film Coating,Decoration film Coating,etc.

 

 

Features of Aluminium Scandium (AlSc) Sputtering Target

 

(1) Composition and Structure Typical Compositions:

Al:Sc = 99:1 at.% (low scandium doping, used to improve the properties of aluminum films)

Al:Sc = 95:5 at.% (high scandium content, used for special functional films)

Al:Sc = 90:10 at.% (used for high-strength or high-temperature-resistant coatings)

Crystal Structure:

Aluminum-based solid solution (face-centered cubic, FCC), the addition of scandium can refine the grains and increase the film density.

At high scandium content, the formation of Al₃Sc nano precipitates (L1₂ structure) may occur, enhancing the hardness of the film.

 

(2) Physical Properties

Performance Value Remarks
Density ~2.7 g/cm³ (close to pure aluminum) Scandium has a higher density (2.99 g/cm³) than aluminum.
Melting Point ~660°C (for pure aluminum) The addition of scandium can improve thermal stability.
Resistivity 3–5 μΩ·cm Slightly higher than pure aluminum but still considered a low-resistance material.
Hardness 50–120 HV Depends on the scandium content and heat treatment.

 

Main applications of Aluminium Scandium (AlSc) Sputtering Target


(1) Semiconductors and microelectronics
High-reliability interconnect materials: Scandium inhibits electromigration of aluminum films and improves chip life.
MEMS devices: AlSc films are used for conductive layers or structural layers of microelectromechanical systems.
(2) Aerospace and high-temperature resistant coatings
Turbine blade coatings: AlScN/AlScO films provide anti-oxidation and anti-corrosion protection.
Lightweight structural materials: Al-Sc alloy films are used to reinforce aviation composite materials.
(3) Optics and optoelectronics
Transparent conductive oxide (TCO) substrates: AlSc films can optimize the adhesion of ITO/ZnO.
Ultraviolet (UV) reflectors: The high reflectivity of AlSc alloys is suitable for deep ultraviolet optical devices.
(4) Superconductivity and quantum computing
Superconducting film substrates: The low resistivity of AlSc is suitable for superconducting circuits (such as superconducting quantum bits).

 

Process of Aluminium Scandium (AlSc) Sputtering Target

 

1) Melting and casting
Vacuum induction melting (VIM): prevent scandium oxidation and ensure uniform composition.
Rapid solidification (such as rapid cold casting): avoid Al₃Sc coarsening and improve target density.

(2) Powder metallurgy (PM)
Applicable to targets with high scandium content (>5 at.%) to avoid component segregation.
Process: high-energy ball milling (Al+Sc powder) → cold isostatic pressing (CIP) → vacuum sintering.

(3) Thermomechanical processing
Hot rolling/hot extrusion: improve target density and mechanical strength.
Heat treatment (annealing): optimize grain size and reduce internal stress.

(4) Machining and bonding
Precision machining to standard size (such as Φ2"–Φ8"), surface roughness ≤0.5μm.
Bonding method: indium welding or silver welding (copper/molybdenum back plate) to ensure uniform heat dissipation.

 

 

FAQ

Are you a factory or manufacturer?
A: Yes, we are a factory but we generally use our trading company to handle the business abroad. It will be more convenient to receive the remittance and arrange the shipment.

What is the delivery method?
A: Generally, we send cargo by UPS, DHL or FedEx. Also, we can send by sea to seaport or by air to the closest airport.

Why is your product so cost-effective?
A: We cut out the middlemen in the end-to-end manufacturing process and we obtain raw material directly from its source.

Do you do spot quality inspection or full inspection?
A: 100% full inspection for sure. All unqualified products are discarded.

How do you ensure your lead time?
A: From material preparation to machining and finally to a full inspection. Every stage of production is strictly monitored and controlled to give you an accurate delivery time.

What is the MOQ of Aluminium Scandium (AlSc) Sputtering Target?
A: Depends on quantity, generally, no MOQ limit.

How to pay for it?
A: A bank transfer (T/T) will be acceptable.

What is the delivery time?
A: around 7-20 days which depends on the quantity and production.

What is kind of the package?
A: Generally, we use a carton case or plywood case with protective material inside to ensure the save of cargo

What is the lead time?
A: from order placed to cargo receiving will take around 10-25 days.

 

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