Tungsten Copper Alloy

We utilize mature process routes—infiltration and liquid-phase sintering—that have been proven through extensive industrial validation, and we implement precise control based on the product's final application scenario. This ensures that performance targets are achieved from the very source of material preparation, rather than simply providing theoretical materials.

1. Dominant Process Routes and Quality Control
Infiltration Method: This method enables the preparation of near-fully dense, high-copper content products, particularly suitable for applications requiring extremely high conductivity/thermal conductivity consistency. We ensure uniform microstructure by precisely controlling the copper infiltration channels and temperature field.
Liquid Phase Sintering Method: For products with complex shapes or specific compositional requirements, this process achieves excellent formability. By optimizing the sintering atmosphere and temperature curve, we actively control the final density and grain structure.

2. Key Controllable Performance Indicators
Our core process control consistently focuses on four dimensions that directly impact your product reliability:
Density: Regularly guaranteed >98.5%, and can reach >99.5% through process optimization. This is the foundation for achieving stable electrical and thermal performance.
Microstructure Uniformity: Ensuring uniform distribution of the tungsten framework and copper phase is fundamental to material performance consistency and batch stability.
Electrical/Thermal Conductivity: Through process control, we ensure that the electrical conductivity and thermal conductivity of the product reach more than 90% of the theoretical optimum value for the material.
Machinability: Optimized processes create a consistent internal stress state and microstructure in the material, making subsequent precision machining such as CNC and grinding more stable and efficient.

3. Recommended Process Selection for Specific Applications
We not only manufacture materials but also provide professional process path selection for your applications:
For EDM long rods/fine electrodes: We recommend and utilize a high-density + high-uniformity process scheme to ensure dimensional stability and low wear rate of the electrodes during deep-hole and long-duration electrical discharge machining.
For high-current electrical contacts: The focus of the process is on improving the material's resistance to arc erosion and welding. By optimizing the copper phase distribution and interface bonding, our contacts have a longer electrical lifespan.
For semiconductor/laser heat sinks: The core of the process lies in precisely controlling the thermal expansion coefficient window and batch consistency of thermal conductivity to ensure reliable matching with the chip or casing and stable heat dissipation performance.