Products Description
Our aluminum copper sputtering target has high hardness, tensile strength and light weight, It is perfect for a number of industries and applications. It has usually 1-3% copper content and has the similar chemical properties with aluminum.
Aluminum copper sputtering target is usually silvery white and has a metallic luster.They are widely used in semiconductor integrated circuits (VLSI), optical discs, flat panel displays, and workpiece surface coatings. In addition, aluminum copper alloys are widely used in seawater cooling systems, papermaking, printing and textile industries, food industries, heat exchangers, automotive industries, and seawater pipeline systems in desalination plants due to their excellent corrosion resistance.
Besides, AlCu has high mechanical properties, excellent machinability, and high-temperature suitability, so it could be the suitable material for high performance Aluminum alloy.
High purity AlCu alloy sputtering target could be used in a broad range of industrial fields from semiconductor and electronic functional components. With 5N high purity, uniform grain size, lower oxygen content, end user can obtain constant erosion rates as well as high purity and homogeneous thin film coating during PVD process.
Specification of Aluminium Copper (AlCu) Sputtering Target
|
Category |
Alloy Sputtering Target |
|
Chemical Formula |
AlCu |
|
Composition |
Aluminum Copper |
|
Purity |
99.9%,99.95%,99.99% |
|
Shape |
Plates,Column Targets,arc cathodes,Custom-made |
|
Production Process |
Vacuum Melting,PM |
|
Available Size |
L≤200mm,W≤200mm |
process of Aluminium Copper (AlCu) Sputtering Target
- Smelting and casting method
Vacuum induction melting (VIM) to prevent oxidation
Rapid cooling (＞100℃/s) to avoid Cu segregation
Typical process flow:
Batching→vacuum melting→quench casting→homogenization annealing→hot rolling→finishing
- Powder metallurgy method
Applicable to nanostructured targets
Process route:
Gas atomization powder making→screening→cold isostatic pressing→vacuum sintering→hot isostatic pressing (HIP)
- Processing requirements
Surface roughness: Ra≤0.4μm
Dimension tolerance: ±0.05mm (target below Φ200mm)
Binding method: ultrasonic welding (copper back plate) or brazing
Core applications of Aluminium Copper (AlCu) Sputtering Target
- Semiconductor field
Interconnect wire (replacing pure Al):
0.5-1% Cu can inhibit electromigration
Key materials for processes below 90nm
Diffusion barrier: AlCu/TiN laminated structure
- Optical coating
Infrared reflector (AlCu/Ag multilayer film)
Solar selective absorption film
- Mechanical engineering
Tool wear-resistant coating (AlCuN composite film)
Bearing surface reinforcement
Performance Comparison (with Different Cu Content)
| Characteristic | Al-0.5%Cu | Al-2%Cu | Al-4%Cu |
|---|---|---|---|
| Resistivity | 3.1 μΩ·cm | 3.3 μΩ·cm | 3.8 μΩ·cm |
| Hardness | 1.2 GPa | 1.5 GPa | 2.1 GPa |
| Deposition Rate | 120 nm/min | 110 nm/min | 95 nm/min |
| Electromigration Lifetime | 10× Pure Al | 15× Pure Al | 8× Pure Al |
Selection recommendations
Semiconductor grade: Al-0.5%Cu (4N5 purity)
Tool coating: Al-4%Cu+reactive sputtering (N₂ atmosphere) is recommended
R&D purposes: consider gradient composition target (Cu 0.5-4% gradient)
Related Sputtering Materials
AlCu99.5/0.5wt% Sputtering Target
AlCu99/1wt% Sputtering Target
AlCu98/2wt% Sputtering Target
AlCu95/5wt% Sputtering Target
AlCu90/10wt% Sputtering Target
AlSiCu 98.5/1/0.5wt% Sputtering Target
AlCuW 98.5/1/0.5 wt% Sputtering Target
FAQ
Are you a factory or manufacturer?
A: Yes, we are a factory but we generally use our trading company to handle the business abroad. It will be more convenient to receive the remittance and arrange the shipment.
What is the delivery method?
A: Generally, we send cargo by UPS, DHL or FedEx. Also, we can send by sea to seaport or by air to the closest airport.
Why is your product so cost-effective?
A: We cut out the middlemen in the end-to-end manufacturing process and we obtain raw material directly from its source.
Do you do spot quality inspection or full inspection?
A: 100% full inspection for sure. All unqualified products are discarded.
How do you ensure your lead time?
A: From material preparation to machining and finally to a full inspection. Every stage of production is strictly monitored and controlled to give you an accurate delivery time.
What is the MOQ of Aluminium Copper (AlCu) Sputtering Target ?
A: Depends on quantity, generally, no MOQ limit.
How to pay for it?
A: A bank transfer (T/T) will be acceptable.
What is the delivery time?
A: around 7-20 days which depends on the quantity and production.
What is kind of the package?
A: Generally, we use a carton case or plywood case with protective material inside to ensure the save of cargo
What is the lead time?
A: from order placed to cargo receiving will take around 10-25 days.
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