Aluminium Neodymium (AlNd) Sputtering Target

Aluminum neodymium alloy is a commonly used magnetron sputtering target. Aluminum has a melting point of 660℃, density of 2.7, and thermal conductivity of 0.53, while neodymium has a melting point of 1024℃, density of 7.0, and thermal conductivity of 0.031. Due to their great differences in melting point, density and thermal conductivity, if produce it directly adopt vacuum melting method, it easily generates segregation and splashes in the melting process, causing pollution, resulting in uneven alloy structure and high impurity content, which seriously affects the alloy quality.

Aluminum-neodymium (AlNd) sputtering target is an important material used in the sputtering coating process. It is widely used in flat panel display, solar cell and other fields. With the continuous upgrading of flat panel display technology and the expansion of solar cell market, the performance requirements of aluminum-neodymium alloy target are getting higher and higher.

The aluminum-neodymium alloy target produced by our company has the characteristics of low resistivity, high heat resistance and high sputtering, which makes it have important applications in the electronic manufacturing industry. The method for making aluminum-neodymium alloy target includes powder metallurgy process, by which a target with no pores, low resistivity and good sputtering effect can be obtained.

In addition, after the heat treatment of the aluminum-neodymium alloy target in the later stage of the thin film transistor manufacturing process, the residual stress is small and it is not easy to produce bumps, which is conducive to optimizing the coating process. In particular, in the distribution of neodymium element in aluminum-neodymium alloy, when the distribution of nd element is greater than 0.9at%, the metal film formed has a more suitable resistivity and significant anti-spot corrosion. The better value is that the concentration of nd element in aluminum element is greater than or equal to 1.3at%.

• Advanced display technology

TFT-LCD gate material
Flexible OLED anode layer
Transparent conductive oxide substrate

• Semiconductor packaging

Wafer-level packaging (WLP) barrier layer
3D TSV interconnect material
Power device heat dissipation coating

• Special functional film

Magneto-optical storage medium
High temperature anti-oxidation coating (800℃)
Quantum dot display electrode

AlNd 97/3wt% Sputtering Target

AlNd 99.4/0.6wt% Sputtering Target

FAQ

Are you a factory or manufacturer?
A: Yes, we are a factory but we generally use our trading company to handle the business abroad. It will be more convenient to receive the remittance and arrange the shipment.

What is the delivery method?
A: Generally, we send cargo by UPS, DHL or FedEx. Also, we can send by sea to seaport or by air to the closest airport.

Why is your product so cost-effective?
A: We cut out the middlemen in the end-to-end manufacturing process and we obtain raw material directly from its source.

Do you do spot quality inspection or full inspection?
A: 100% full inspection for sure. All unqualified products are discarded.

How do you ensure your lead time?
A: From material preparation to machining and finally to a full inspection. Every stage of production is strictly monitored and controlled to give you an accurate delivery time.

What is the MOQ of  Aluminium Neodymium (AlNd) Sputtering Target?
A: Depends on quantity, generally, no MOQ limit.

How to pay for it?
A: A bank transfer (T/T) will be acceptable.

What is the delivery time?
A: around 7-20 days which depends on the quantity and production.

What is kind of the package?
A: Generally, we use a carton case or plywood case with protective material inside to ensure the save of cargo

What is the lead time?
A: from order placed to cargo receiving will take around 10-25 days.

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