Description Of 4N ZrO2 Sputtering Target with Cu Backplate
A ZrO₂ sputtering target equipped with a copper backing plate is a critical material utilized in thin-film fabrication via Physical Vapor Deposition (PVD) technology. It primarily consists of a high-purity Zirconia (ZrO₂) target billet bonded through a specialized process to a copper backing plate characterized by high thermal and electrical conductivity. The core component of this assembly is the ZrO₂ target billet, acting as the target bombarded by high-energy ion beams, releasing atoms or molecules that subsequently deposit onto a substrate to form a thin film. Since ceramic materials such as ZrO₂ inherently possess limited electrical and thermal conductivity-and face mechanical stability challenges within the sputtering environment-they necessitate integration with a backing plate. The primary functions of the copper backing plate are to securely mount the target, conduct electrical current, and provide an efficient thermal pathway for dissipating the heat generated during the sputtering process. Its exceptional thermal conductivity (exceeding 400 W/m·K) effectively prevents localized overheating of the target, thereby ensuring the stability of the sputtering process and extending the operational lifespan of the target material.
Applications Of 4N ZrO2 Sputtering Target with Cu Backplate
In high-end manufacturing sectors-such as semiconductors, optical coatings, and display technologies-thin-film quality is critical to product performance. The use of ZrO₂ sputtering targets featuring copper backing plates helps ensure the uniformity and consistency of thin-film quality by enhancing process stability and target utilization; this, in turn, reduces the frequency of equipment maintenance, thereby supporting the continuous and efficient operation of production lines.
Specifications Of 4N ZrO2 Sputtering Target with Cu Backplate
Purity: 99.9%-99.99%
Shape: Discs, Plates, Column Targets, Custom-made
Round sputtering target
Diameter: <18", Thickness: >0.04"
Rectangular sputtering target
Length: <36", Width: <12", Thickness: >0.04"
Quality Control and Testing of 4N ZrO2 Sputtering Target with Cu Backplate
FAQ For 4N ZrO2 Sputtering Target with Cu Backplate
Are you a factory or a manufacturer?
A: Yes, we are a 4N ZrO2 Sputtering Target with Cu Backplate factory, but we generally use our trading company to handle the business abroad. It will be more convenient to receive the remittance and arrange the shipment.
What is the delivery method?
A: Generally, we send 4N ZrO2 Sputtering Target with Cu Backplate by UPS, DHL, or FedEx. Also, we can send by sea to a seaport or by air to the closest airport.
Why is your 4N ZrO2 Sputtering Target with Cu Backplate so cost-effective?
A: We cut out the middlemen in the end-to-end manufacturing process, and we obtain raw material directly from its source.
Do you do spot quality inspection of products?
A: 100% full inspection for sure. All unqualified 4N ZrO2 Sputtering Targets with Cu Backplate are discarded.
How do you ensure your lead time?
A: From material preparation to machining and finally to a full inspection. Every stage of production is strictly monitored and controlled to give you an accurate delivery time.
What is the MOQ of 4N ZrO2 Sputtering Target with Cu Backplate?
A: Depends on the quantity of 4N ZrO2 Sputtering Target with Cu Backplate; generally, no MOQ limit.
How to pay for the products?
A: A bank transfer (T/T) will be acceptable.
What is the delivery time?
A: Around 7-20 days, which depends on the quantity and production of 4N ZrO2 Sputtering Target with Cu Backplate.
What kind of package is it?
A: Generally, we use a carton case or plywood case with protective material inside to ensure the safety of the 4N ZrO2 Sputtering Target with Cu Backplate.
What is the lead time?
A: From the order placed to cargo receiving will take around 10-25 days.
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