Aluminium Silicon (AlSi) Sputtering Target

The targets are prepared by blending Aluminum and Silicon powders, followed by HIP. The thus compacted materials are optionally sintered and are then formed into the desired target shape.

Our Aluminum Silicon sputtering targets are available in rectangular, circular, or custom-made geometric forms, with Aluminum content from 10-90% atomic, and feature high purity, homogeneous microstructure, high density, and long working life.

Aluminum Silicon alloy is extensively used in automotive, aircraft, and construction industries for its unique combination of desirable characteristics, including light weight, good thermal conductivity, and mechanical properties. The density of this material is 2.6~2.7g/cm3, thermal conductivity coefficient 101~126W/(m·℃), tensile modulus 71.0GPa, fatigue limit ±45MPa. Aluminum-silicon alloys also possess excellent corrosion resistance, machinability, and weldability.

Aluminum-silicon alloys are used in a variety of automotive, aerospace, and consumer product applications, like engine blocks and cylinder liners, pistons, bearing alloy materials, and consumer electronics components. It has a high melting point, ductility, hardness, and corrosion resistance.

Our Aluminum Silicon sputter target is tagged and labeled externally to ensure efficient identification and quality control. Great care is taken to avoid any damage that might be caused during storage or transportation.

Composition ratio:
The common ratio is Al: Si = 90:10 wt.% (most commonly used) or Al: Si = 98:2 wt.% (low silicon type). The addition of silicon (Si) can inhibit the growth of aluminum (Al) whiskers and improve the thermal stability of the film.
When the silicon content exceeds 12%, a eutectic structure may be formed (such as Al-12Si eutectic alloy).
Density: ≥99% theoretical density (reduce particle splashing during sputtering).
Purity: Usually ≥99.99% (4N grade), especially Fe, Cu, and other impurities need to be controlled (affecting semiconductor performance).
Conductivity: slightly lower than pure aluminum target (silicon is a semiconductor, but AlSi alloy still maintains high conductivity).

Melting and casting: Vacuum induction melting (to avoid oxidation) followed by rapid cooling to prevent silicon segregation.
Powder metallurgy: Suitable for nanostructured or high silicon content targets (such as Al-20Si), formed by ball milling, cold isostatic pressing (CIP) and sintering.
Thermomechanical processing: Hot rolling or hot extrusion to improve organizational uniformity and reduce porosity.
Machining: Precision turning to standard size (such as Φ2 inches ~ Φ8 inches), surface roughness ≤ 0.2μm.

Semiconductor interconnection:
The addition of silicon can inhibit the electromigration of aluminum film and improve the reliability of integrated circuits.
Metalization layer used for CMOS, DRAM, and other devices.
Solar cells: As back electrode materials (such as PERC cells), high reflectivity and low contact resistance are required.
Optical coating: AlSiOx or AlSiNx is generated by reactive sputtering for anti-reflection or protective film.
Braze material: Sputtered AlSi film is used for a low-temperature brazing layer in electronic packaging.

Are you a factory or a manufacturer?
A: Yes, we are a factory, but we generally use our trading company to handle the business abroad. It will be more convenient to receive the remittance and arrange the shipment.

What is the delivery method?
A: Generally, we send cargo by UPS, DHL or FedEx. Also, we can send by sea to a seaport or by air to the closest airport.

Why is your product so cost-effective?
A: We cut out the middlemen in the end-to-end manufacturing process and we obtain raw material directly from its source.

Do you do spot quality inspection or full inspection?
A: 100% full inspection for sure. All unqualified products are discarded.

How do you ensure your lead time?
A: From material preparation to machining and finally to a full inspection. Every stage of production is strictly monitored and controlled to give you an accurate delivery time.

What is the MOQ of Aluminium Silicon (AlSi) Sputtering Target?
A: Depends on quantity; generally, no MOQ limit.

How to pay for it?
A: A bank transfer (T/T) will be acceptable.

What is the delivery time?
A: around 7-20 days, which depends on the quantity and production.

What kind of package is it?
A: Generally, we use a carton case or a plywood case with protective material inside to ensure the safety of the cargo

What is the lead time?
A: From the order placed to cargo receiving will take around 10-25 days.

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