Molybdenum Sputtering Target

Our high-performance Molybdenum (Mo) Sputtering Targets, engineered for precision thin-film deposition in advanced semiconductor, display, energy, and aerospace applications. With stringent quality control and customization capabilities, we ensure reliable solutions for your cutting-edge manufacturing needs.

Molybdenum coatings are essential components of thin-film transistors in TFT-LCD and OLED screens, which control individual pixels.

Molybdenum sputtering targets are required to apply extremely thin, electrically conductive molybdenum coatings, which are indispensable control elements in any type of display. During this process in a vacuum chamber, the molybdenum sputtering targets are ejected from the target material by bombarding it with argon ion atoms. The atoms are ionized in the argon plasma and deposited on the display as an extremely thin layer.

Molybdenum coatings have other uses as well. For example, as back contacts for thin-film solar cells (CIGS, CdTe) and in microelectronic components (semiconductor components, SAW/BAW frequency filters, photolithography).

(1) Semiconductor manufacturing

Advanced process interconnection: Mo/W composite barrier layer

Transistor gate: MoS₂ thin film

(2) Display technology

OLED anode: ultra-thin Mo film 

TFT backplane: Mo-Al-Mo sandwich structure 

(3) High temperature protection

Aerospace engine: Mo-Si-B coating 

Nuclear fusion device: Mo first wall material

(4) New energy devices

Photovoltaic cell: Mo back electrode 

Lithium battery current collector: nanoporous Mo film 

High purity and low impurities: key impurities (C, O, etc.) are controlled at the ppm level to ensure the electrical properties of the film.

Controllable grains: (110) preferred orientation or nanocrystalline structure is achieved through thermomechanical treatment to optimize sputtering uniformity.

Customized services: Support customization of size (Φ50mm-Φ500mm), shape (plane/rotating target) and composite structure (gradient composition, multi-layer design).

✅ Industry Standards – Compliant with ASTM B387, SEMI F72.
✅ Performance Data – Provided with RRR (Residual Resistivity Ratio) >150, grain size analysis, and density reports.
✅ Advanced Manufacturing – HIP (Hot Isostatic Pressing) for pore-free targets; precision machining for edge uniformity.

MoTi sputtering target

MoRe sputtering target

MoTi sputtering target

MoO3 sputtering target

MoS2 sputtering target

WMo sputtering target

FAQ

Are you a factory or manufacturer?
A: Yes, we have a factory but we generally use our trading company to handle the business abroad. It will be convenient to receive the remittance and arrange the shipment.

What is the delivery method?
A: Generally, we send cargo by UPS, DHL or FedEx. Also, we can send by sea to seaport or by air to the closest airport.

Why is your product so cost-effective?

A: We cut out the middlemen in the end-to-end manufacturing process. We obtain our raw material directly from its source.

Do you do spot quality inspection or full inspection?
A: 100% full inspection. Inspectors will check the finished product individually, to ensure they adhere to all parameters. All unqualified products are discarded.

How do you ensure your lead time?
A: We have an efficient Order Management System, from material preparation to machining, and finally to a full inspection. Every stage of production is strictly monitored and controlled to give you an accurate delivery time.

What is the MOQ ?
A: Depends on quantity, generally, no MOQ limit.

How to pay for it?
A: A bank transfer (T/T) will be acceptable.

What is the delivery time?
A: around 7-20 days which depends on the quantity and production.

What is kind of the package?
A: Generally, we use a carton case or plywood case with protective material inside to ensure the save of cargo

What is the lead time?
A: from order placed to cargo receiving will take around 10-25 days.

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