Tantalum Sputtering Target
Tantalum Sputtering Target

Tantalum Sputtering Target

Element Symbol:Ta
Purity:3N5, 4N, 4N5, 5N
Shape:Planar target, Rotary target
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Products Description

 

As a typical representative of high-melting-point refractory metals, tantalum plays an irreplaceable role in the fields of semiconductors, medical implants and superconducting materials due to its excellent chemical stability and unique electrical properties.

 

Tantalum Sputtering Target is produced by EB melting. It's usually applied for magnetic recording media, printer components, flat panel displays, optic, industrial glass, and thin film resistors. High purity Tantalum Sputtering Target is normally used for semiconductor industry. Its high natural strength with low thermal expansion coefficient, together with its ability to stick to both copper and silicon make it the perfect choice for a diffusion barrier to prevent copper and silicon from interacting.

 

Specification 

 

Characteristic Value/Description Application Significance
Atomic Number 73 Identification as a transition metal
Density 16.69 g/cm³ Basis for calculating thin film deposition rates
Melting Point 3017°C Foundation for applications in extreme environments
Crystal Structure BCC (α phase) Key for phase transformation control
Resistivity 131 nΩ·m Reference for integrated circuit wiring
Dielectric Constant (Ta₂O₅) ε~25 High-k gate dielectric material
Biocompatibility Inert oxide layer Preferred for medical implants

 

Application 

(1) Advanced semiconductor processes

Nodes below 5nm: TaN diffusion barrier layer (thickness <2nm)

3D NAND: Ta/TaN stacked step coverage (aspect ratio >60:1)

(2) Biomedical engineering

Orthopedic implants: Ta porous coating (porosity 70%, bone ingrowth rate increased by 3 times)

Vascular stents: Ta-O film (anti-coagulation performance exceeds 316L stainless steel)

(3) Superconducting quantum computing

Superconducting resonant cavity: Ta film (surface resistance <10nΩ@4.2K)

Quantum bit: Ta/NbTiN Josephson junction (coherence time >100μs)

(4) Corrosion-resistant coating

Chemical equipment: Ta-W alloy coating (resistant to boiling hydrochloric acid corrosion)

 

Related Sputtering Materials

 

Tantalum Oxide (Ta2O5) Sputtering Target

CoTaZr Sputtering Target

Tantalum Pellets

Tantalum Crucible liner

 

 

FAQ

Are you a factory or manufacturer?
A: Yes, we have a factory but we generally use our trading company to handle the business abroad. It will be convenient to receive the remittance and arrange the shipment.

What is the delivery method?
A: Generally, we send cargo by UPS, DHL or FedEx. Also, we can send by sea to seaport or by air to the closest airport.

Why is your product so cost-effective?
A: We cut out the middlemen in the end-to-end manufacturing process and we obtain our raw material directly from its source.

Do you do spot quality inspection or full inspection?
A: 100% full inspection. Inspectors will check the finished product individually, to ensure they adhere to all parameters. All unqualified products are discarded.

How do you ensure your lead time?
A: We have an efficient Order Management System, from material preparation to machining, and finally to a full inspection. Every stage of production is strictly monitored and controlled to give you an accurate delivery time.

What is the MOQ ?
A: Depends on quantity, generally, no MOQ limit.

How to pay for it?
A: A bank transfer (T/T) will be acceptable.

What is the delivery time?
A: around 7-20 days which depends on the quantity and production.

What is kind of the package?
A: Generally, we use a carton case or plywood case with protective material inside to ensure the save of cargo

What is the lead time?
A: from order placed to cargo receiving will take around 10-25 days.

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