Silicon Sputtering Target
Silicon Sputtering Target

Silicon Sputtering Target

Polysilicon sputtering target is a key material used in the semiconductor, photovoltaic and display industries. It is mainly used to make polysilicon thin films and is widely used in transistors, solar cells, display panels and other fields.
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Products Description

 

Polysilicon sputtering target is a sputtering material made of high-purity silicon (Si). It is used in the physical vapor deposition (PVD) process to prepare polysilicon thin films and is widely used in the semiconductor, photovoltaic and display industries.

 

Common types


Intrinsic polysilicon (undoped): used for semiconductor gates, thin film transistors (TFTs)
Doped polysilicon (P-type/B-type):
P-type: doped with boron (B), used for PMOS, solar cells
N-type: doped with phosphorus (P) or arsenic (As), used for NMOS, DRAM capacitors
Hydrogenated amorphous silicon (a-Si:H): prepared by sputtering + hydrogen plasma, used for thin film solar cells

 

Main applications


(1) Semiconductor devices
MOSFET gate: replaces metal gate to reduce short channel effect
DRAM capacitor: polysilicon electrode of high dielectric constant (High-k) material

(2) Display technology
TFT-LCD/OLED: polysilicon thin film transistor (LTPS, low temperature polycrystalline silicon) driving backplane
MicroLED: high mobility polysilicon for pixel switching

(3) Photovoltaics (solar cells)
Thin film solar cells: amorphous silicon/microcrystalline silicon stacked cells
TOPCon cells: tunnel oxide passivated contact (Tunnel Oxide Passivated Contact Contact)

(4) MEMS (micro-electromechanical system)
Conductive layer of pressure sensor and accelerometer

 

Silicon (Si) Specifications

 

Material Type

Silicon

Symbol

Si

Atomic Weight

28.0855

Atomic Number

14

Color/Appearance

Dark Gray with a Bluish Tinge, Semi-Metallic

Thermal Conductivity

150 W/m.K

Melting Point (°C)

1,410

Bulk Resistivity

>1 OHM-CM

Coefficient of Thermal Expansion

2.6 x 10-6/K

 

Related Sputtering Materials

 

SiAl planar / rotary target

SiO2 sputtering target

SiC sputtering target

Si3N4 sputtering target

 

 

FAQ

Are you a factory or manufacturer?
A: Yes, we are a factory but we generally use our trading company to handle the business abroad. It will be more convenient to receive the remittance and arrange the shipment.

What is the delivery method?
A: Generally, we send cargo by UPS, DHL or FedEx. Also, we can send by sea to seaport or by air to the closest airport.

Why is your product so cost-effective?
A: We cut out the middlemen in the end-to-end manufacturing process. We obtain our raw material directly from its source.

Do you do spot quality inspection or full inspection?
A: 100% full inspection. Inspectors will check the finished product individually, to ensure they adhere to all parameters. All unqualified products are discarded.

How do you ensure your lead time?
A: From material preparation to machining, and finally to a full inspection. Every stage of production is strictly monitored and controlled to give you an accurate delivery time.

What is the MOQ of Silicon Sputtering Target?
A: Depends on quantity, generally, no MOQ limit.

How to pay for it?
A: A bank transfer (T/T) will be acceptable.

What is the delivery time?
A: around 7-20 days which depends on the quantity and production.

What is kind of the package?
A: Generally, we use a carton case or plywood case with protective material inside to ensure the save of cargo

What is the lead time?
A: from order placed to cargo receiving will take around 10-25 days.

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