Sputtering Target Ti50Al50

Sputtering Target Ti50Al50

Sputtering target Ti50Al50 is a kind of target material with a 50% titanium (Ti) and 50% aluminum (Al) composition, which is used in the sputtering process for depositing thin films. Sputtering is a physical vapor deposition (PVD) technique used to create thin films by ejecting atoms from a solid target material and depositing them onto a substrate.
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Products Description

 

The Ti50Al50 sputtering target is a PVD coating material composed of equal atomic ratios of titanium and aluminum (Ti 50%, Al 50%). With high purity (≥99.95%) and homogeneous microstructure, it enables the deposition of high-performance thin films. This target combines titanium's high strength with aluminum's excellent conductivity, demonstrating superior oxidation resistance (withstanding temperatures up to 800°C) and stable sputtering rates, making it particularly suitable for reactive sputtering processes.

 

Features of Sputtering Target Ti50Al50

 

- Alloy Composition: The Ti50Al50 composition provides a balance of the properties of both titanium and aluminum. Titanium contributes to the strength, corrosion resistance, and high melting point, while aluminum enhances the ductility and electrical conductivity.

- Corrosion Resistance: The alloy is corrosion-resistant, which can be beneficial for applications where the deposited film will be exposed to corrosive environments.

- Thermal Conductivity: Sputtering Target Ti50Al50 has good thermal conductivity, which can be advantageous for applications that require efficient heat transfer.

- Electrical Conductivity: The alloy has moderate electrical conductivity, which can be useful in applications where the film will serve as an electrical conductor.

 

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Applications of Sputtering Target Ti50Al50

 

1

Electronics:

WNiCu alloy components are particularly prominent in the electronics sector due to their advantageous properties, including high electrical and thermal conductivity, as well as effective electromagnetic shielding. In power electronics, these components function as advanced heat sinks, effectively dissipating heat from high-power transistors and integrated circuits. A balance between density and weight is achieved because of their high density (16–18 g/cm³), enabling their use in precision vibration-damping tasks in instruments and as counterweights in robotic arms for semiconductor manufacturing. The alloy's non-magnetic properties are crucial for MRI machines and other devices that operate in magnetic fields where minimal interference is essential, as well as in precision measurement tools.

Aerospace:

WNiCu alloy parts are used in aerospace as counterweights, balance masses, and other components where their high density and thermal properties are advantageous.

Automotive:

WNiCu alloy parts are used in automotive design for balance weights, vibration dampers, and other high-density components that require a high mass-to-volume ratio.

Medical:

WNiCu alloy parts are used in medical devices for applications that require precise balancing or high density, including radiation shielding and imaging devices.

Oil and Gas:

The alloys are used in the construction of drill collar counterweights, shielding housings for Measurement While Drilling (MWD) systems, and counterbalancing components for other downhole tools, owing to their high density (16–18 g/cm³), corrosion resistance, and mechanical strength. All these characteristics make WNiCu alloys an excellent choice for critical applications in petroleum drilling operations. Additionally, WNiCu alloys enhance the performance of non-magnetic downhole electromagnetic measurement devices, ensuring no interference with tool operations. Their non-magnetic properties also improve drilling verticality control, as increased density enhances the weight amplification capabilities of vertical drilling tools.

 

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Specification of Sputtering Target Ti50Al50

 

Chemical components (at%)

Ti33Al67

Ti50Al50

Ti70Al30

Purity (%)

99.8

99.8

99.8

Density (g/cm³)

3.29

3.6

3.95

Grain size (μm)

≤100

≤100

≤100

Heat conductivity (W/m.K)

98

70

40

Heat expansion (1/K)

1.9*10-5

1.75*10-5

1.35*10-5

Specification dimensions (mm)

Cylindrical targets:

Monolithic forming by HIP process

Length: ≤2000

Thickness: ≤15

FAQ:

What is the MOQ?
A: Depends on quantity, generally, no MOQ limit.

How to pay for it?
A: A bank transfer (T/T) will be acceptable.

What is the delivery time?
A: around 7-20 days which depends on the quantity and production.

What is the package?
A: cartoon case or plywood case.

What is the lead time?
A: from order placed to cargo receiving will take around 10-25 days.

What is the delivery method?
A: Generally, we send cargo by UPS, DHL or FedEx. Also, we can send by sea to seaport or by air to the closest airport.

 What is the main advantage of 50/50 TiAl composition?
A: The equiatomic ratio provides optimal balance between:
✓ Ti's mechanical strength
✓ Al's oxidation resistance
✓ Film stress control during deposition

 What purity levels are available?
Standard grades:
• 99.95% (industrial applications)
• 99.99% (semiconductor grade)
• 99.999% (research grade)

What bonding methods are recommended?
• Indium soldering (<150°C)
• Diffusion bonding (for high-power use)
• Mechanical clamping (quick replacement)

 Typical applications?

Turbine blade TBCs

Semiconductor diffusion barriers

Cutting tool coatings

Decorative finishes

 How to handle/store properly?

Keep in argon-filled packaging

Store at <40% humidity

Pre-sputter clean before use

 Available sizes and forms?
• Diameter: 2"-12" (custom up to 24")
• Thickness: 0.25"-1"
• Shapes: Round, rectangular, segment

 Why choose over TiAlN targets?
When you need:
✓ Better high-temp stability
✓ Lower residual stress
✓ Lighter colored coatings

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