Tungsten Copper Foils

0.1mm 0.5mm Tungsten Copper Foils is a pseudo alloy composed of high melting point and high strength tungsten and high conductivity and thermal conductivity copper. Due to its excellent corrosion resistance, welding resistance, high strength, high hardness and other advantages, 0.1mm 0.5mm Tungsten Copper Foils are currently widely used as an electrical contact material, plasma electrode material, high-temperature military material, heat sink substrate and packaging material. With the continuous development of high-tech, the requirements for the performance of tungsten copper materials are also increasing. Traditional infiltration sintering can no longer meet the requirements for high strength and high airtightness, which require a relative density close to full density, and for forming complex shaped parts that are close to finished shapes.

In the electrical and electronic industry, 0.1mm 0.5mm Tungsten Copper Foils can be used as an electrical contact material for high-voltage switchgear and circuit breakers of different current types, which can increase the voltage level and power of the equipment.

The remarkable performance combines the high strength, arc ablation resistance and melting point of tungsten, alongside copper's conductivity. This makes them outstanding in the field of bearing high temperature, strength, and thermal conduction of electricity.

As for thermal expansion, the coefficient can be modifiable in this material due to the changing ratio of copper and tungsten to suit the requirements of different materials, hence minimizing thermal stress concentration.

The tungsten copper foil is applied and used as an electrode and for high-temperature electrode applications in electrical discharge machining activities. The alloy's remarkable properties such as a very high melting point, excellent strength, along with good electrical and thermal conduction makes the tungsten copper foil electrode stable and reliable during high-pressure/ high-temperature applications. The tungsten copper foil composition qualifies for use in electronic packaging as a chip packaging and circuit boarding interconnection material while meeting the requirements of contemporary electronic gadgets having ultra high conductivity, good thermal conductivity, and a low coefficient of thermal expansion.

Are you a factory or manufacturer?
A: Yes, we are a factory but we generally use our trading company to handle the business abroad. It will be more convenient to receive the remittance and arrange the shipment.

What is the delivery method?
A: Generally, we send cargo by UPS, DHL or FedEx. Also, we can send by sea to seaport or by air to the closest airport.

Why is your product so cost-effective?
A: We cut out the middlemen in the end-to-end manufacturing process and we obtain raw material directly from its source.

Do you do spot quality inspection or full inspection?
A: 100% full inspection for sure. All unqualified products are discarded.

How do you ensure your lead time?
A: From material preparation to machining and finally to a full inspection. Every stage of production is strictly monitored and controlled to give you an accurate delivery time.

What is the MOQ of (产品名称)?
A: Depends on quantity, generally, no MOQ limit.

How to pay for it?
A: A bank transfer (T/T) will be acceptable.

What is the delivery time?
A: around 7-20 days which depends on the quantity and production.

What is kind of the package?
A: Generally, we use a carton case or plywood case with protective material inside to ensure the save of cargo

What is the lead time?
A: from order placed to cargo receiving will take around 10-25 days.

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