Metal Titanium Sputtering Target

Description of Metal Titanium Sputtering Target

In recent years, with the rapid development of my country's integrated circuit, flat panel display, solar energy, and other industries, the demand for metal targets used in the sputtering process has risen rapidly, and Metal Titanium Sputtering Target is a very important functional film in the field of electronic information materials.

Titanium has good corrosion resistance and adhesion, so Metal Titanium Sputtering Target is often used for sputtering deposition of pure titanium film or reactive sputtering deposition of TiN film, mainly used as a diffusion barrier layer interconnected with aluminum, and interconnected with copper A hard mask layer, a cap layer to protect the nickel-platinum compound film layer, and an anti-reflection layer.

The Metal Titanium Sputtering Target provided by our company has high purity, among which 99.95%, 99.99% and 99.995% high-purity targets can be produced, and have also passed strict quality inspections, so you can order our products with confidence.

Features of Metal Titanium Sputtering Target

High density and uniform microstructure

Density ≥ 4.5 g/cm³, porosity < 0.1%, reducing particle splashing and defects during sputtering.

Controllable grain size (usually 10~50μm), improving sputtering rate and film uniformity.

Excellent sputtering performance

High sputtering rate, low nodulation tendency, suitable for long-term continuous coating.

Can be made into flat targets, rotating targets or special-shaped targets, suitable for a variety of PVD equipment.

Diverse material selection

Pure titanium target (Gr1-Gr4), titanium alloy target (such as Ti-6Al-4V), nitrogen-doped titanium target (TiN), etc.

The surface can be bound to a copper/aluminum backplane to improve heat dissipation performance.

Long service life

High utilization design (rotating target utilization > 80%), reducing production costs.

Applications of Metal Titanium Sputtering Target

1. Semiconductor and microelectronics
Barrier layer (such as Ti/TiN) and interconnect layer (Cu/Ti) coating in integrated circuits.

Conductive film deposition of memory devices (DRAM, 3D NAND).

2. Optical coating
Metal transition layer of anti-reflection film, reflector, and filter.

Electrode coating of display panel (OLED, LCD).

3. Decoration and tool coating
TiN gold coating for mobile phone housing and watch coating.

Wear-resistant TiAlN hard coating for cutting tools and molds.

Surface and coating options of Metal Titanium Sputtering Target

• Standard state: Ra≤0.2 μm, edge chamfer R0.5–1.0 mm.
• Functional coating: 0.1 μm Ta diffusion layer on the inner surface improves oxidation resistance at 650 °C; 2 μm Cu plating on the back improves thermal conductivity by 20%.
• Color customization: Reactive sputtering TiN/TiAlN can produce 10+ colors such as golden yellow, gun black, rose red, etc.

Specifications of Metal Titanium Sputtering Target

Testing and quality control of Metal Titanium Sputtering Target

FAQ for Metal Titanium Sputtering Target

What is the MOQ?

A: Depends on quantity; generally, no MOQ limit.

How to pay for it?

A: A bank transfer (T/T) will be acceptable.

What is the delivery time?

A: around 7-20 days, which depends on the quantity and production.

What is the package?

A: cartoon case or plywood case.

What is the lead time?

A: From the order placed to cargo receiving will take around 10-25 days.

What is the delivery method?

A: Generally, we send cargo by UPS, DHL, or FedEx. Also, we can send by sea to a seaport or by air to the closest airport.

Picture of Metal Titanium Sputtering Target

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