1. Material properties
High melting point (2620℃), suitable for extremely high temperature environments.
Excellent thermal conductivity (138 W/m·K), excellent heat dissipation performance.
Low thermal expansion coefficient (4.8×10⁻⁶/℃), dimensional stability at high temperature.
Good mechanical strength, creep resistance is better than that of tungsten and tantalum.
High purity advantage (Fe, Ni, C, and other impurities <0.05%), reducing high temperature oxidation and grain boundary embrittlement.
2. Key production processes
1) Powder metallurgy + rolling: Molybdenum powder is isostatically pressed → sintered → hot rolled → cold rolled to the target thickness (0.01~0.2mm).
2) Surface treatment: pickling/electrolytic polishing to remove the oxide layer, or nickel/gold plating to enhance corrosion resistance.
3) Precision slitting: laser or diamond tool cutting to ensure burr-free edges.
3. Typical application areas
Semiconductor industry: Heaters and heat insulation baffles in wafer manufacturing (high temperature resistance, low pollution). Vacuum coating involves the evaporation of source substrate materials.
New energy and nuclear industry: Solar cell back electrode (replace copper foil, high temperature aging resistance). Nuclear reactor neutron absorption component coating.
Aerospace: Rocket nozzle insulation pads, high temperature sensor substrates.
Medical equipment: X-ray tube, anode target support foil.
4. Industry trends and challenges
Demand growth: The localization of semiconductor equipment has driven the increase in the purchase of high-purity molybdenum foil (annual growth rate of about 12%).
Technical barriers: The rolling process and surface defect control of ultra-thin molybdenum foil (<0.03mm) are key difficulties.
Competition of alternative materials: The choice between tungsten foil (higher temperature but more brittle) and graphite (low cost but low strength) needs to be evaluated according to the application scenario.
5. Purchase recommendations
Certification standards: in compliance with ASTM B386 (industrial grade), GB/T 17792 (electronic grade).
Performance testing: focus on impurity content (GDMS analysis), grain size (SEM), and room temperature/high temperature tensile strength.
Supplier selection: give priority to manufacturers with vacuum annealing (to reduce internal stress) and clean packaging (anti-oxidation) capabilities.
Conclusion
99.95% pure molybdenum foil has become an irreplaceable material for high-end manufacturing due to its unique high-temperature resistance and stability. With the upgrading of the semiconductor and new energy industries, its precision and thinness development will further expand the application boundaries.