Tungsten Heavy Alloy Part

Tungsten Heavy Alloy Part can maintain the ejection direction of ion beam, increase the durability of the component, and realize the purpose of changing the conductivity of semiconductor devices and transistor structure. Tungsten Heavy Alloy Part can be used to manufacture various semiconductor devices, such as transistors, integrated circuits, microelectronic devices, solar cells and so on.

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Tungsten Heavy Alloy Part

Semiconductor ion implantation technology is a kind of high technology of material surface modification, which has been widely used in the doping of semiconductor materials and the surface modification of metals, ceramics, polymers, etc., and has become an indispensable means of contemporary large-scale integrated circuit manufacturing.

Tungsten Heavy Alloy Part is generally made of tungsten alloy after sintering, forging, rolling and machining. It has the advantages of high density, good mechanical properties, strong corrosion resistance, high tensile strength, strong heat shock resistance, good wear resistance, non-toxic, environmental protection and long service life.

Tungsten Heavy Alloy Part can be used to manufacture various semiconductor devices, such as transistors, integrated circuits, microelectronic devices, solar cells and so on.

Specification of Tungsten Heavy Alloy Part

Grade	WMo,WNiFe
Technique	Rolling,Forging,Flattening,Annealing,Machining
Melting Point	3410℃
Purity	≥95%
Size and Shape	According to drawings
Maximum Outside Diameter	800mm
Density	19.3g/cm3
Surface	Polishing,Chemical Cleaning,Powder coating, etc.
Standard	ASTM B777,DIN,GB,ISO,JIS