Products Description
In the semiconductor industry, tungsten (W), molybdenum (Mo) and their alloys are widely used in key components due to their excellent physical and chemical properties.
Ion implantation is a very important technology in modern IC manufacturing, which uses ion implanters to dope semiconductors, i.e., using tungsten-thorium wires as cathodes to emit electrons to bombard gas molecules containing specific impurity elements, resulting in ionized specific impurity atoms accelerated by electrostatic fields onto the surface of silicon single crystal wafers and into the semiconductor, changing the conductive properties and eventually forming transistor structures. The ion injector consists of a gas system, a vacuum system, a motor system, a control system, and a beamline system.
The beamline system includes the ion source, extraction electrode, mass spectrometer, back-end accelerator, charge neutralization system, wafer handler, and beam blocker. Tungsten devices made from thick (2~45 mm) tungsten plates are mainly used in the ion source system of semiconductor ion implanters to confine and shield ionizing rays, and are the key components of the ion source system.
Features of Tungsten Molybdenum Semiconductor Parts
The purity of the molybdenum waveguide is above 99.95%;
Its density is higher than 10.2g/cm³;
Precisely machined and with excellent surface roughness;
Molybdenum waveguide is of strong wear resistance.
Key Performance Advantages
| Characteristic | Tungsten | Molybdenum |
|---|---|---|
| Melting Point | 3422°C (the highest among all metals) | 2623°C |
| Thermal Conductivity | 173 W/(m·K) | 138 W/(m·K) |
| Coefficient of Thermal Expansion (CTE) | 4.5×10⁻⁶/K (close to silicon) | 5.3×10⁻⁶/K (matches silicon/gallium arsenide) |
| Corrosion Resistance | Resistant to molten metal erosion | Acid and base resistant, but susceptible to oxidation at high temperatures |
Application of Tungsten Molybdenum Semiconductor Parts
Tungsten (W)
1. Interconnection and filling materials
Used as tungsten plugs (W-Plug) in integrated circuits, filling vias (Via) and contact holes through CVD (chemical vapor deposition) process, due to its high melting point (3422°C) and good conductivity.
As a gate electrode material (replacing polysilicon), it has excellent stability, especially in high-temperature processes.
2. Heater and thermal field components
Heater and diffusion furnace components in semiconductor equipment, resistant to high-temperature corrosion.
3. Ion implantation components
Used for collimators and absorbers of ion implanters, because tungsten can withstand high-energy ion bombardment.
Molybdenum (Mo)
1. Sputtering target
Used to deposit thin films (such as gate or electrode layers of TFT-LCD), purity requirements ≥99.95%.
2. Support and structural parts
Single crystal furnace thermal field components (such as crucibles, heat shields), because molybdenum still maintains high strength at 1600°C.
3. Electrodes and leads
Molybdenum sheets in power semiconductor devices (such as IGBT) have a coefficient of thermal expansion (CTE) close to that of silicon, which reduces thermal stress.
FAQ of Tungsten Molybdenum Semiconductor Parts
Are you a factory or manufacturer?
A: Yes, we are a factory but generally, we use our trading company to handle the business abroad. It will be convenient to receive the remittance and arrange the shipment.
What is the delivery method?
A: Generally, we send cargo by UPS, DHL or FedEx. Also, we can send by sea to seaport or by air to the closest airport.
Why is your product so cost-effective?
A: We cut out the middlemen in the end-to-end manufacturing process. Rather than obtaining semi-finished goods from other suppliers, we obtain our raw material of APT powder directly from its source.
Do you do spot quality inspection or full inspection?
A: 100% full inspection. Inspectors will check the finished product individually, to ensure they adhere to all parameters. All unqualified products are discarded.
How do you ensure your lead time?
A: We have an efficient Order Management System, from material preparation to machining, and finally to a full inspection. Every stage of production is strictly monitored and controlled to give you an accurate delivery time.
What is the MOQ?
A: Depends on quantity, generally, no MOQ limit.
How to pay for it?
A: A bank transfer (T/T) will be acceptable.
What is the delivery time?
A: around 7-20 days which depends on the quantity and production.
What is kind of the package?
A: Generally, we use a carton case or plywood case with protective material inside to ensure the save of cargo
What is the lead time?
A: from order placed to cargo receiving will take around 10-25 days.
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