Copper Molybdenum Alloy Foil
Copper Molybdenum Alloy Foil is light in weight, has good sealing and workability, and is more suitable for application in the aerospace field. The similar material has Mo-Cu, moly copper, CuMo, copper-clad molybdenum, 60/40 65/35 70/30 75/25 80/20 85/15, Mo85Cu, Mo80Cu, Mo70Cu, Mo60Cu, Mo50Cu, Molybdenum-Copper Composite Material, CuMoCu, CMC, Cu/Mo70Cu/Cu, CPC, 35495-47-5.
Copper Molybdenum Alloy Foil often adopts powder metallurgy process, which is mixed and pressed with high-quality molybdenum powder and copper powder, and then put into a mold for sintering and forming, and then it is made after a series of mechanical processing such as rolling, drawing, cutting and polishing, and has a melting point High, very high electrical and thermal conductivity, non-magnetic, low gas content, excellent high temperature resistance, good heat dissipation, low cost and long service life.
Copper Molybdenum Alloy Foil are very suitable for application in microelectronics industry, integrated circuits, optical communications, high temperature industry, electromagnetic shielding materials, vacuum electronic devices and military equipment, etc.
Specification of Copper Molybdenum Alloy Foil
|
Grade |
Mo50cu50,Mo60cu40,Mo70cu30,Mo85cu15 |
|
Technique |
Hot Rolling,cold rolling,Sintering,Forging,Annealing |
|
Purity |
Mo:50%-75%,Cu:25%-50% |
|
Length |
Customized |
|
Thickness |
0.05-1mm |
|
Width |
Customized |
|
Density |
9.66g/cm3 |
|
Surface |
Polishing,Alkali Cleaning,Machining,Grinding,Ground,etc. |
|
Standard |
ASTM B702 |
Picture of Copper Molybdenum Alloy Foil

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