Spooled Diameter 0.14mm EP Electrolytic Polishing Tungsten Wires Are Sent To Japan

Jun 18, 2025 Leave a message

Spooled Diameter 0.14mm EP Electrolytic Polishing Tungsten Wires Now Available!

 

Yitech is proud to announce the successful development and launch of our latest high-precision product: Spooled Diameter 0.14mm EP (Electrolytic Polishing) Tungsten Wires. This cutting-edge advancement reinforces our commitment to delivering superior materials for industries requiring ultra-fine, high-performance tungsten wires. Thanks for suport and trust from our Japanese customer, they ordered this size tungsten wire with quantity 1200 meters. And the production time taken around 15 days EP tungsten wires are widely used for semiconductor applications. 

 

Key Features & Benefits:

Ultra-Fine Diameter (0.14mm) – Ideal for applications demanding extreme precision, such as medical devices, semiconductor manufacturing, and microelectronics.
Electrolytic Polishing (EP) Technology – Ensures a ultra-smooth surface, reducing friction and improving performance in high-precision applications.
Superior Mechanical Properties – High tensile strength, excellent thermal stability, and corrosion resistance.
Spooled for Convenience – Optimized for seamless integration into automated production processes.

 

Specifications of Tungsten wire
tungsten wire size: our minimum size dia0.01mm(10um)
1) usual thin micron size ultra-fine tungsten wire size:10 um,15um,20um,25um--50um
with black and white surface
2) thick wire size: dia0.1mm,0.2mm,0.3mm,0.4mm,0.5mm etc
3) more strand tungsten twisted wire: 1-10 strands(we will supply as customers need)
4) tungsten heating coils wire,welding wire,cutting wire
Tungsten wire size surface&processing state attachment

 

Item
diameter(mm)

length(mm)

Diameter tolerance(mm)

surface

State
99.95%
W rod

8.0~16.0

10~850

10~660

Black

forged

3.0~8.0

10~5000

10~800

Black

forged
99.95%
W wire

1.5~3.0

10~8000

10~1600

Black

drawing

0.5~1.5

10~8000

10~2650

Black

drawing

 

Applications:

1. Heating Elements in CVD/PVD Processes

Tungsten wires serve as resistive heating elements in Chemical Vapor Deposition (CVD) and Physical Vapor Deposition (PVD) systems.

They provide uniform high-temperature environments for depositing thin films on semiconductor wafers.

2. Filaments in Electron Beam Evaporation

Used as electron beam (e-beam) sources in evaporation systems to deposit metals (e.g., Al, Cu, Au) and dielectrics.

Tungsten's high melting point prevents deformation under extreme heat.

3. Probes for Wafer Testing

Tungsten wire is used in microprobes for electrical testing of semiconductor wafers due to its stiffness and conductivity.

Its minimal thermal expansion ensures stable contact resistance.

 

 

news-700-700

 

Why Choose Our Tungsten Wires?

With years of expertise in advanced material manufacturing, We ensures consistent quality, tight tolerances, and reliable performance-meeting the stringent demands of modern high-tech industries.

For inquiries or orders, please contact:
📧 Email: [info@yitechtrading.com
🌐 Website: [www.yitechtrading.com]

Stay ahead with yitech -Precision Engineered for Excellence!