Molybdenum Ion Implant Parts
Molybdenum Ion Implant Parts

Molybdenum Ion Implant Parts

Tungsten and molybdenum components play a vital role in ion implantation. These components are usually used in key parts of ion implanters, such as chambers, filaments, blades, brackets, cathodes, etc.
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Products Description

 

Molybdenum semiconductor ion implant parts are essential parts of the semiconductor processes. They are also important in the ion implantation process. Specifically, ion implantation is a methodology that employs energetic ions to modify the physical and chemical attributes of various materials, particularly when producing intricate electronic parts with precise defined operational traits.

 

Molybdenum components play a important role in ion implantation. These components are usually utilized in the most critical areas of ion implanters like, chambers, filaments, blades, brackets, cathodes, etc.

 

Features and Core Advantages

 

Feature Value in Semiconductor Industry
High Melting Point (2623°C) Tolerates high-temperature processes in semiconductor manufacturing (such as CVD, annealing).
Low Coefficient of Thermal Expansion Matches with silicon wafers (Si), reducing wafer warping due to thermal stress.
Excellent Thermal Conductivity (138 W/m·K) Rapid heat dissipation, enhances the reliability of high-power devices (such as GaN/SiC).
High Purity (≥99.95%) Avoids metal contamination (Na/K/U/Th <1ppb), complies with SEMI F47 standards.
Good Mechanical Strength Supports wafer handling systems, better resistance to deformation than graphite.

 

Applications of Molybdenum ion implantation parts

 

Front-End

Ion implanter: Molybdenum collimator, beam stop.

Diffusion/LPCVD equipment: Heater, heat shield.

Lithography machine: EUV mirror substrate (low thermal deformation).

Back-End

Power module: Molybdenum copper (MoCu) heat dissipation substrate (CTE matching Si chip).

Lead frame: high current carrying capacity, replacing traditional copper alloy.

 

 

Specification of molybdenum ion implantation.

 

Grade

Mo,TZM

Technique

Hot Rolling,Forging,Flattening,Annealing,Machining

Melting Point

2610℃

Purity

Mo≥99.95%

Size / Shape

Customized

Density

10.2g/cm3

Surface

Polishing, Anodizing, Zinc plating,Chemical Cleaning,Powder coating, etc.

Standard

ASTM B777,DIN,GB

 

 

 

FAQ for molybdenum ion Iimplant parts

 

1. Why do semiconductor ion implanters need tungsten and molybdenum materials?
✅ High melting point: Tungsten (W, 3422°C) and molybdenum (Mo, 2623°C) can withstand the high temperature environment of ion implantation and avoid thermal deformation.
✅ Low sputtering rate: Reduce target material loss and extend component life.
✅ Chemical stability: Resistant to plasma corrosion, suitable for highly reactive gases (such as BF₃, PH₃).
✅ Mechanical strength: Support the impact of high-energy ion beams and reduce wear.

 

2. Which parts of ion implanters utilize tungsten/molybdenum?

Part Material Function
Ion Source Electrode Tungsten/Molybdenum Emits ions; must withstand high temperatures and sputtering
Beam Collimator Tungsten Focuses ion beams to reduce scattering
Implantation Target Molybdenum Supports the wafer and resists thermal deformation
Plasma Chamber Wall Tungsten Corrosion resistance to extend the life of the chamber

 

3. Performance Comparison of Tungsten and Molybdenum in Ion Implanters

Characteristics Tungsten (W) Molybdenum (Mo)
Melting Point 3422°C 2623°C
Thermal Conductivity Higher Moderate
Cost Higher Lower
Machinability More Difficult (due to high hardness) Easier
Suitable Applications Extremely high-energy implantation Conventional implantation

 

4. What are the manufacturing processes for tungsten and molybdenum parts?
Powder metallurgy: high-temperature sintering (>2000°C) to make high-density parts.
Machining: CNC precision turning/milling (tungsten is brittle and requires special tools).

 

5. What is the MOQ of molybdenum ion implantation parts.
A: Depends on quantity, generally, no MOQ limit.

 

6. How to pay for it?
A: A bank transfer (T/T) will be acceptable.

 

7. What is the delivery time?
A: around 7-20 days which depends on the quantity and production.

 

8. What is the package?
A: carton case or plywood case.

 

9. What is the lead time?
A: from order placed to cargo receiving will take around 10-25 days.

 

10. What is the delivery method?
A: Generally, we send cargo by UPS, DHL or FedEx. Also, we can send by sea to seaport or by air to the closest airport.

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