Moly Copper Alloy Plate

Moly Copper Alloy plate is more suitable for products with more stringent weight requirements, such as the manufacture of military and civilian high-power microelectronic devices, high-precision semiconductor devices, electrical contact materials or electronic packaging materials.

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Moly Copper Alloy plate

Molybdenum copper alloy as a important alloy materials, in aerospace, aviation, navigation, military, national defense, electronics, electric power, metallurgy, machinery, sports equipment and other industries have a wide range of applications.

Moly Copper Alloy plate is an alloy material composed of molybdenum and copper, which is often made by different processes such as powder metallurgy, liquid phase sintering method and molybdenum skeleton infiltration method, and can replace tungsten copper alloy products in many cases.

Moly Copper Alloy plate contains the excellent characteristics such as high strength, non-magnetic, high temperature resistance, high thermal conductivity, low adjustable thermal expansion coefficient, excellent vacuum performance, good machining performance, light weight and long service life.

Specification of Moly Copper Alloy plate

Grade	MoCu30
Technique	Hot Rolling,Cold Rolling,Sintering,Annealing,Drawing
Length	Customized
Thickness	Customized
Width	Customized
Density	9.5g/cm3-10g/cm3
Shape	Square,Rectangle,Coil,Strip
Surface	Polishing,Alkali Cleaning,Machining,Grinding,Ground,Black Oxide, etc.
Standard	GB,JIS,ASTM,DIN,EN,ISO