HD17BB alloy is a tungsten-based high-density alloy, usually composed of tungsten (W) and other metals (such as nickel (Ni), iron (Fe), copper (Cu), etc.), with high density, high strength, good radiation shielding performance and machinability. The following is a comparative analysis of HD17BB and other common tungsten alloys
1. Composition comparison
HD17BB:
Typical composition: about 90-97% W, the rest is Ni-Fe or Ni-Cu bonding phase.
Features: Optimize strength and machinability by adjusting the bonding phase ratio.
Other tungsten alloys:
W-Ni-Fe alloy (such as WNiFe90):
Tungsten content is 90-95%, Ni/Fe ratio is usually 7:3, with high strength and ductility.
W-Ni-Cu alloy (such as WNiCu85):
Tungsten content is 85-90%, Ni/Cu bonding phase, non-magnetic but slightly lower strength.
Pure tungsten (W):
Purity ≥99.95%, extremely high hardness but brittle and difficult to process.
Tungsten copper alloy (W-Cu):
Contains 10-50% copper, good thermal and electrical conductivity, used in electronic devices.
2. Comparison of physical and mechanical properties
| Feature | HD17BB | W-Ni-Fe (e.g., 90%) | W-Ni-Cu (e.g., 85%) | Pure Tungsten | W-Cu (e.g., 70/30) |
| Density (g/cm³) | 16.5-17.5 | 16.5-17.5 | 15-16.5 | 19.3 | 14-16 |
| Tensile Strength (MPa) | 800-1000 | 900-1200 | 600-800 | 500-700 (brittle) | 500-700 |
| Ductility (%) | 5-15 | 10-30 | 5-10 | <2 | 3-8 |
| Thermal Conductivity (W/m·K) | 50-70 | 50-70 | 40-60 | 170 | 180-200 |
| Electrical Conductivity | Medium | Medium | Medium | High | Extremely High |
| Magnetic Properties | Weakly magnetic (contains Fe) | Weakly magnetic | Non-magnetic | Non-magnetic | Non-magnetic |
3. Application field comparison
HD17BB:
Commonly used in scenarios that require a balance between density, strength and processability, such as:
Aerospace counterweights
Radiation shielding (medical/nuclear industry)
Armor-piercing projectile cores (military)
W-Ni-Fe alloy:
High-strength applications, such as missile components and vibration dampers.
W-Ni-Cu alloy:
Scenarios without magnetic field interference, such as MRI equipment counterweights and precision instruments.
Pure tungsten:
High-temperature components (bulb filaments), semiconductors (wafer manufacturing).
W-Cu alloy:
Electronic heat sinks, high-voltage switch contacts.
4. Processing performance comparison
HD17BB:
Can be turned and drilled, better than pure tungsten but requires carbide tools.
W-Ni-Fe:
Better ductility, suitable for complex shape processing.
Pure tungsten:
Requires powder metallurgy or electrospark machining (EDM), almost uncuttable.
5. Cost factors
HD17BB:
The cost is lower than pure tungsten, but higher than W-Cu (because Cu is cheap).
W-Ni-Fe/Cu:
The ratio of the binder phase affects the price (Ni price fluctuates greatly).
Summary
Choice basis:
High strength + processability required → W-Ni-Fe (such as WNiFe90).
No magnetic requirements → W-Ni-Cu.
High thermal/electrical conductivity → W-Cu.
Extreme density/high temperature resistance → pure tungsten.
Comprehensive balance → HD17BB.
The advantage of HD17BB lies in its versatility, which is suitable for industrial scenarios that require density, strength and processability, while other tungsten alloys are optimized for specific properties.
