Products Description
Molybdenum copper alloy (Mo-Cu) is an alloy material composed of two metal elements, molybdenum and copper, with advantages such as good processing performance, high strength, high temperature resistance, arc ablation resistance, etc. This alloy combines the advantages of copper and molybdenum, including high strength, high specific gravity, high temperature resistance, arc ablation resistance, good electrical and thermal conductivity, and good processing performance.
It uses high-quality molybdenum powder and oxygen-free copper powder, and is manufactured through isostatic pressing (high-temperature sintering-copper infiltration) process to ensure product purity and accurate ratio, fine structure, and excellent performance. We can supply molybdenum copper alloy (Mo-Cu) products includes rod, bar, plate, sheet and pipe. Please contact us if any needs.
Features of Molybdenum copper alloy
| Characteristics | Value/Performance | Advantage Description |
|---|---|---|
| Coefficient of Thermal Expansion (CTE) | 5.5–9.5 × 10⁻⁶/K (adjustable) | Matches semiconductor materials (such as Si, GaAs) to reduce thermal stress |
| Thermal Conductivity | 160–220 W/(m·K) | Close to pure copper (400 W/(m·K)), excellent heat dissipation |
| Density | 9.5–10.5 g/cm³ | Lighter than pure tungsten (19.3 g/cm³) |
| Strength | Tensile Strength ≥ 500 MPa | Higher than pure copper, resistant to mechanical impact |
| Electrical Conductivity | 40–60% IACS (International Annealed Copper Standard) | Meets the electrical conductivity requirements of electronic devices |
Types of Molybdenum copper alloy
Mo60Cu40: Balances thermal conductivity and strength, used for electronic packaging.
Mo50Cu50: Optimizes electrical conductivity, suitable for electrode materials.
Mo85Cu15: High rigidity, used for high-temperature structural parts.
Applications of Molybdenum copper alloy
🔹 Electronic packaging and thermal management
Power device substrate: heat dissipation substrate for IGBT and LED (replacing Al₂O₃ ceramics).
Microwave components: T/R module housing (low CTE matching GaAs chip).
Vacuum electronic devices: traveling wave tube collector (high thermal conductivity + high temperature resistance).
🔹 Aerospace and military industry
Missile servo heat sink: resistant to high temperature air flow scouring.
Satellite structural parts: lightweight and dimensionally stable.
🔹 Industrial field
Resistance welding electrode: high melting point + conductivity, extending electrode life.
Laser heat sink: quickly export the heat generated by high-energy laser.
Specification of Molybdenum copper alloy
|
Material |
Mo Content |
Cu Content |
Density |
Thermal Conductivity 25℃ |
CTE 25℃ |
|
Wt% |
Wt% |
g/cm3 |
W/M∙K |
(10-6/K) |
|
|
Mo85Cu15 |
85±1 |
Balance |
10 |
160-180 |
6.8 |
|
Mo80Cu20 |
80±1 |
Balance |
9.9 |
170-190 |
7.7 |
|
Mo70Cu30 |
70±1 |
Balance |
9.8 |
180-200 |
9.1 |
|
Mo60Cu40 |
60±1 |
Balance |
9.66 |
210-250 |
10.3 |
|
Mo50Cu50 |
50±0.2 |
Balance |
9.54 |
230-270 |
11.5 |
|
Mo40Cu60 |
40±0.2 |
Balance |
9.42 |
280-290 |
11.8 |
Comparison of molybdenum-copper alloy with competing materials
| Material | Advantages | Disadvantages | Suitable Applications |
| Molybdenum-Copper Alloy | Adjustable CTE, high thermal conductivity, lightweight | Higher cost than AlN ceramics | High-power electronic packaging |
| Tungsten-Copper Alloy | Higher strength, lower CTE | High density (16–18 g/cm³) | Aerospace high-temperature components |
| AlN Ceramics | Insulating, high thermal conductivity | Brittle, difficult to process | RF device insulating substrates |
| Pure Copper | Best electrical/thermal conductivity | Excessive CTE (17×10⁻⁶/K) | Low thermal stress scenarios |
FAQ of Molybdenum Copper alloy
What is molybdenum copper alloy?
Answer: Molybdenum copper alloy is a composite material composed of molybdenum (Mo) and copper (Cu), combining the high melting point and low coefficient of thermal expansion (CTE) of molybdenum with the high thermal conductivity and electrical conductivity of copper.
Whats is typical applications of molybdenum copper alloy?
1.Electronic packaging : power device substrate (IGBT, LED), microwave component housing.
2.Thermal management: laser heat sinks, high-power electronic heat sinks.
3. Aerospace: missile heat sinks, satellite structural parts.
4. Industrial field: resistance welding electrodes, vacuum electronic devices.
What are the price factors of molybdenum-copper alloy?
Molybdenum content: The higher the molybdenum ratio, the higher the cost (molybdenum price > copper price).
Process complexity: The melt infiltration process is 20–30% more expensive than ordinary sintering.
Surface treatment: Additional processing such as polishing and plating increases costs
What is the MOQ?
A: Depends on quantity, generally, no MOQ limit.
How to pay for it?
A: A bank transfer (T/T) will be acceptable.
What is the delivery time?
A: around 7-20 days which depends on the quantity and production.
What is the package?
A: cartoon case or plywood case.
What is the lead time?
A: from order placed to cargo receiving will take around 10-25 days.
What is the delivery method?
A: Generally, we send cargo by UPS, DHL or FedEx. Also, we can send by sea to seaport or by air to the closest airport.
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